March 8, 2010 WNA Amritapuri Campus
Together with the Technical University of Delft, they’ve also designed a modular test bed with sensor emulation: each test bed unit consists of a mini-PC with an I/O board with dedicated SPI/I2C/UART/ADC connections for up to four nodes.
You can find more information here.
Amtrak has issued a Request for Qualifications (RFQ) for a communications platformincluding passenger Wi-Fi in its trains all over the US. Amtrak will issue another RFQ shortly after this one to support automated on-board signage, announcements and end-of-car displays that use the communications platform. Then it will issue a national task order RFP. Below is an excerpt from the RFQ.
* * * * * * * *
1. Purpose of Request for Qualifications (RFQ)
Amtrak is seeking to identify a complete technology solution that will serve as an onboard communications platform (the “Platform”). The Platform will include a robust, self-healing, self-configuring onboard network and associated equipment that forms the foundation to support two primary services: (1) Wi-Fi for passengers and (2) a secure Wi-Fi channel for Amtrak business needs to support on-board transactions (such as ticketing or on-board sales). In addition, the system will be capable of supporting automated onboard electronic informational displays and announcements, content caching and delivery (e.g., for custom content as well as audio and video entertainment), and other business services.
Amtrak envisions that the Platform will include at its core a wireless and wired infrastructure, a communications control unit, and an off-board multi-technology communications system. The Platform will be supported through a hardened data center that will be capable of real-time monitoring and reporting on the Platform and related services.
The established Platform will be used as the basis for an ongoing national standard for all of the trains in the Amtrak fleet and, at Amtrak Rail Partners’ option, for their fleets as well. Hereinafter, Amtrak and Rail Partners shall be collectively referred to as Amtrak.
1.1 Selection Process
The selection process includes three elements: two RFQs followed by a National Request for Proposal (RFP). Amtrak will use the RFQs to select core national technology standards which will subsequently be procured and implemented through the National RFP, as follows:
• RFQ 1: Communications Platform, including Passenger Wi-Fi: This first RFQ seeks responses from vendors for the on-board Communications Platform, including: (a) onboard train communications network, (b) Wi-Fi for passenger and business use; and (c) content caching and support for future applications as noted under RFQ 2. Requirements for RFQ 1 are detailed in Sections 2 and 4.
• RFQ 2: Onboard Train Information Systems (OTIS): The second RFQ, which will shortly follow the first, will seek qualifications from vendors for OTIS. The OTIS will utilize the Communications Platform identified in RFQ 1 to support automated on-board signage and announcements and end-of-car displays.
• RFP for Solutions Implementation: Once the core technologies are identified through the RFQ process, a national task order RFP will be issued which will establish master contracts with a series of installers who will, with participation of the core technology vendors, equip specific trains with the respective Communications Platform and OTIS systems.
At Amtrak’s option, the RFP phase will include one or two RFPs. If two RFPs are issued, each RFP will correspond to either RFQ1 or RFQ2. If only one RFP is issued, that RFP will encompass all features of the proposed on-board technologies. The RFP will result in a selection of a set of vendors qualified to work on a task-order basis to install, operate and maintain these systems for Amtrak across the United States.
Tue, Mar 2 04:45 PM
Washington, March 2 (ANI): Scientists from the Massachusetts Institute of Technology (MIT) have created a new infrared laser made from germanium that operates at room temperature, which has made light-speed computing come one step closer to reality.
The research removes the cryogenic cooling systems previously needed for infrared lasers and could lead to powerful computer chips that operate at the speed of light.
"Using a germanium laser as a light source, you could communicate at very high data rates at very low power," said Jurgen Michel of the Massachusetts Institute of Technology, who developed the new germanium laser.
"Eventually, you could have the computing power of today's supercomputers inside a laptop," he said.
The creation of a new laser, even one based on germanium, is not newsworthy; more than 15,000 different lasers, some of which use germanium, have been created since the 1950s.
What makes this particular germanium laser unique is that it creates an infrared beam at room temperature.
Until now infrared germanium lasers required expensive cryogenic cooling systems to operate. The new germanium laser operates at room temperature.
To create the germanium laser, the scientists take a six-inch, silvery-gray disk of silicon and spray it with a thin film of germanium.
These same disks are actually used to produce chips in today's computers.
An electrically powered, room-temperature, infrared laser for laptop computers is still years away, however, cautioned Michel.
If and when those laptops do arrive, they will be powerful - more powerful in fact than even today's supercomputers.
The battery that powers the laptop won't necessarily last any longer, but the power it does hold will make calculations orders of magnitude faster than today.
"We need high-density, low-power solutions," said Kock.
Computer chips are constantly getting smaller and smaller, but they are approaching the fundamental limits of electron-based computing.
Light-based computing is one option to improve the speed and power of computers.
"Germanium-based optical computing is an especially attractive material for optical computing because it wouldn't require any change to the existing computer chip industry," Kock said.
The same machines that use silicon could also use germanium to make future chips. (ANI)
